Substrate convey processing device, trouble countermeasure method in substrate convey processing device, and trouble countermeasures program in substrate convey processing device

ABSTRACT

A plurality of process modules for conducting processes on a wafer; conveying modules for conveying the wafer, a turnout module for transferring the wafer to/from the conveying module, and a CPU for detecting a trouble occurring in the process module and centrally controlling each of the modules based on a detection signal. When the controller detects the trouble occurring in any one of the process modules, the wafer to be conveyed to the process module where the trouble occurs is conveyed to the turnout module, and conveyance of the wafer before the process module where the trouble occurs is temporarily stopped, and conveyance and processing of the other wafer are continued, and thereafter, conveyance and processing of the wafer before the process module where the trouble occurs are conducted.

TECHNICAL FIELD

The present invention relates to substrate convey processing deviceswhich conduct processes on substrates such as semiconductor wafers orLCD glass substrates, in a distributed manner, with use of a pluralityof process modules, and more specifically, to a substrate conveyprocessing device with a countermeasure for a situation where a troubleoccurs in any one of such process modules.

BACKGROUND ART

Generally, in production of a substrate such as semiconductor wafer orLCD (Liquid Crystal Display), the photolithography technique is utilizedfor forming a thin film of ITO (Indium Tin Oxide) or an electrodepattern on the substrate. The photolithograph technique employs asubstrate convey processing device in which a substrate is conveyed to aplurality of process modules where photoresist is applied to thesubstrate to be exposed to light for a development process thereafter.

This type of substrate convey processing device includes a carrying-incassette module for accommodating a plurality of unprocessed substrates,a plurality of process modules for executing predetermined processes onthe substrates, a carrying-out cassette module for accommodating theprocessed substrates, and a conveying module for conveying thesubstrates between each of the modules, and is so designed that thesubstrates from the carrying-in cassette module are conveyed to each ofthe process modules in a distributed manner by the conveying module, andthe substrates are processed in the plurality of process modules in adistributed manner.

Conventionally, in this type of substrate convey processing device, whena trouble occurs in a certain module while the substrate is beingconveyed to each module in a stage of processing substrates in theplurality of process modules in a distributed manner, a conveyancedestination of the substrate under conveyance is changed to anothernormally-operating module, whereby conveyance of any other substrates inthe device is prevented from stopping due to occurrence of the troublein the certain module (see, for example, Japanese Patent Laying-Open No.9-050948 (Patent Document 1), Japanese Patent Laying-Open No. 11-016983(Patent Document 2)).

Patent Document 1 Japanese Patent Laying-Open No. 9-050948 PatentDocument 2: Japanese Patent Laving-Open No. 11-016983 DISCLOSURE OF THEINVENTION Problems to be Solved by the Invention

However, in the stage of processing the substrates in a distributedmanner process time is sometimes very long. Therefore, when theconveyance destination of the substrate under conveyance is changed toanother normally-operating module in response to occurrence of thetrouble in the certain module, there arises a problem that substrateconveyance is delayed until the process of the certain module ends.

Further, delay in conveyance of the substrate leads to a problem thatvariation occurs in cycle time controls and production yield isdeteriorated.

The present invention was devised in consideration of the aboveproblems, and it is an object of the present invention to provide asubstrate convey processing device and a trouble countermeasure methodtherefor, and a trouble countermeasures program which allow smoothexecution of conveyance and processing of a substrate, keeping cycletime control, and improvement in production yield even when a troubleoccurs in some of modules.

Means for Solving the Problems

In order to solve the above problems, a substrate convey processingdevice of the present invention includes a carrying-in cassette modulefor accommodating a plurality of unprocessed substrates to be processed,a plurality of process modules for conducting predetermined processes onthe substrate to be processed, a carrying-out cassette module foraccommodating the processed substrates, and conveying modules forconveying the substrate to be processed between each of the modules, inwhich the substrate to be processed from the carrying-in cassette moduleis conveyed to each of the process modules in a distributed manner bythe conveying module, and the substrate to be processed is processed byeach of the plurality of process modules in a distributed manner, andthe substrate convey processing device further includes: a turnoutmodule for transferring the substrate to be processed to/from theconveying module, and a controller for detecting a trouble occurring inthe process module and centrally controlling each of the modules basedon a detection signal, wherein when the controller detects a troubleoccurring in any one of the process modules, the substrate to beprocessed to be conveyed to the process module where the trouble occursis conveyed to the turnout module, and conveyance of the substrates tobe processed before the process module where the trouble occurs istemporarily stopped and conveyance and processing of other substrates tobe processed are continued, and thereafter, conveyance and processing ofthe substrates to be processed before the process module where thetrouble occurs are conducted.

Further, a trouble countermeasure method of the present invention is atrouble countermeasure method in a substrate convey processing devicewhich includes: a carrying-in cassette module for accommodating aplurality of unprocessed substrates to be processed; a plurality ofprocess modules for conducting predetermined processes on the substrateto be processed; a carrying-out cassette module for accommodating theprocessed substrates; and conveying modules for conveying the substrateto be processed between each of the modules, in which the substrate tobe processed from the carrying-in cassette module is conveyed to each ofthe process modules in a distributed manner by the conveying module, andthe substrate to be processed is processed by each of the plurality ofprocess modules in a distributed manner, and the trouble countermeasuremethod includes the steps of detecting a trouble occurring in any one ofthe process modules; conveying the substrate to be processed to beconveyed to the process module where the trouble occurs to a turnoutmodule for transferring the substrate to be processed to/from theconveying module based on a signal detected by the controller;temporarily stopping conveyance of the substrates to be processed beforethe process module where the trouble occurs; continuing conveyance andprocessing of the substrates to be processed after the process modulewhere the trouble occurs; and thereafter conducting conveyance andprocessing of the substrates to be processed before the process modulewhere the trouble occurs, by a controller for centrally controlling eachof the modules.

In the present invention, the turnout module may be any module to whichthe substrate to be processed to be conveyed to the process module wherethe trouble occurs can be conveyed, and may be any one of e.g., atransfer module which is disposed between blocks having a plurality ofmodules and transfers the substrate to be processed between the adjacentblocks, a buffer module which is disposed in the block having theplurality of modules and capable of transferring the substrate to beprocessed in the block, or an unused vacant module, as well as aseparately provided module.

A trouble countermeasures program of the present invention executes thetrouble countermeasure method, and is a trouble countermeasures programin a substrate convey processing device which includes: a carrying-incassette module for accommodating a plurality of un-processed substratesto be processed; a plurality of process modules for conductingpredetermined processes on the substrate to be processed, a carrying-outcassette module for accommodating the processed substrates; andconveying modules for conveying the substrate to be processed betweeneach of the modules, in which the substrate to be processed from thecarrying-in cassette module is conveyed to each of the process module ina distributed manner by the conveying module, and the substrate to beprocessed is processed by each of the plurality of process modules in adistributed manner, and the trouble countermeasures program causes acomputer to execute the procedures of detecting a trouble occurring inany one of the process modules; conveying the substrate to be processedto be conveyed to the process module where the trouble occurs to aturnout module for transferring the substrate to be processed to/fromthe conveying module based on the detection signal; temporarily stoppingconveyance of the substrates to be processed before the process modulewhere the trouble occurs; continuing conveyance and processing of thesubstrates to be processed after the process module where the troubleoccurs; and thereafter conducting conveyance and processing of thesubstrates to be processed before the process module where the troubleoccurs.

With the configuration as described above, when the trouble occurs inany one of the process modules in a state where the substrate to beprocessed from the carrying-in cassette module is conveyed to each ofthe process modules in a distributed manner by the conveying module, andthe substrate to be processed is processed in each of the plurality ofprocess modules in a distributed manner, the trouble is detected by thecontroller. Then, according to the detected signal, the controllerconveys the substrate to be processed to be conveyed to the processmodule where the trouble occurs to the turnout module for transferringthe substrate to be processed to/from the conveying module, andconveyance of the substrates to be processed before the process modulewhere the trouble occurs is temporarily stopped, and conveyance andprocessing of the substrates to be processed after the process modulewhere the trouble occurs are continued. Thereafter, conveyance andprocessing of the substrates to be processed before the process modulewhere the trouble occurs may be conducted.

EFFECTS OF THE INVENTION

Since the present invention has the configuration as described above,the following effects are obtained. According to the present invention,the substrate to be processed to be conveyed to the process module wherethe trouble occurs is conveyed to the turnout module, conveyance of thesubstrates to be processed before the process module where the troubleoccurs is temporarily stopped, conveyance and processing of thesubstrates to be processed after the process module where the troubleoccurs are continued, and thereafter, conveyance and processing of thesubstrates to be processed before the process module where the troubleoccurs may be conducted. Therefore, even when the trouble occurs in partof the modules, it is possible to conduct conveyance and processing ofthe substrates to be processed smoothly, keep cycle time control, andimprove production yield.

Further, according to the present invention, by realizing the turnoutmodule with the transfer module disposed between the blocks having theplurality of modules, for transferring the substrate to be processedbetween the adjacent blocks, it is possible to share the existenttransfer module provided in the device, and to further downsize thedevice.

Further, according to the present invention, by realizing the turnoutmodule with the buffer module disposed in the block having the pluralityof modules, and capable of transferring the substrate to be processed inthe block, it is possible to share the existent buffer module providedin the device, and to further downsize the device.

Furthermore, according to the present invention, by realizing theturnout module with an unused vacant module, it is possible to share theexistent module provided in the device, and to further downsize thedevice.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view showing a first embodiment of a resistapplication, exposure and development processing system having asubstrate convey processing device according to the present invention.

FIG. 2 is a schematic plan view showing a state where a trouble occursin an application module as a process module in the present invention.

FIG. 3 is a schematic plan view showing a state where a wafer isconveyed to a turnout module in the present invention.

FIG. 4 is a schematic plan view showing a state where the wafer isconveyed to a normally-operating application module from the turnoutmodule.

FIG. 5 is a schematic plan view showing a state where conveyance of thewafer before the application module where the trouble occurs is stopped,and conveyance and processing of the wafer after the same are continued.

FIG. 6 is a schematic plan view showing a state where conveyance andprocessing of the wafer before the application module where a troubleoccurs are continued.

FIG. 7 is a schematic plan view showing a state where the trouble occursin a single module in the present invention.

FIG. 8 is a schematic plan view showing a state where the wafer isconveyed to the turnout module in a case where the trouble occurs in thesingle module.

FIG. 9 is a flowchart showing procedures of a trouble countermeasuremethod in the present invention.

FIG. 10 is a schematic plan view showing a second embodiment of theresist application, exposure and development processing system havingthe substrate convey processing device according to the presentinvention.

DESCRIPTION OF THE REFERENCE SIGNS

1: carrying-in cassette module, 2: carrying-out cassette module 4:processing part, 4A: first processing block, 4B: second processingblock, 5: exposure part, 6: first interface part, 7: second interfacepart, 11: first transfer module, 12: second transfer module, 13: thirdtransfer module, 20: application module process module), 21: first ovenmodule (process module), 22: second oven module (process module), 23:development module (process module), 30: turnout module, 31: firstconveying module, 32: second conveying module, 33: third conveyingmodule, 34: fourth conveying module, 40: circumference exposure module(process module), 50: buffer module, 60: CPU (controller).

BEST MODES FOR CARRYING OUT THE INVENTION

In the following, the best mode for carrying out the present inventionwill be described in detail based on the attached drawings. Here,description will be made for a case where a substrate convey processingdevice according to the present invention is applied to a resistapplication, exposure and development processing system of asemiconductor wafer.

FIG. 1 is a schematic plan view showing the resist application, exposureand development processing system of the semiconductor wafer in whichthe substrate convey processing device according to the presentinvention is applied.

As shown in FIG. 1, the resist application, exposure and developmentprocessing system (hereinafter, referred to as “processing system”) hasa carrying-in carrying-out part 3 having a carrying-in cassette module 1for accommodating a plurality of semiconductor wafers W (hereinafter,referred to as “wafer W”) which are un-processed substrates to beprocessed, and a carrying-out cassette module 2 for accommodatingprocessed wafers W, provided in parallel to each other, a processingpart 4 having a plurality of process modules as will be described laterfor conducting predetermined processes on wafer W, an exposure part 5, afirst interface part 6 as a block disposed between carrying-incarrying-out part 3 and processing part 4, and a second interface part 7as a block disposed between processing part 4 and exposure par 3.

The processing part 4 includes a first processing block 4A disposedsequentially from first interface part 6 via a first transfer module(TRS) 11, and a second processing block 4B disposed sequentially fromsecond interface part 7 via a third transfer module (TRS) 13, and firstprocessing block 4A and second processing block 4B are disposedsequentially with each other via a second transfer module (TRS) 12. Eachof first, second and third transfer modules 11, 12, 13 has atransferring part for wafer W carried out from carrying-in cassettemodule 1 and conveyed to exposure part 5, and a transferring par forwafer W conveyed from exposure part 5 to carrying-out cassette module 2,arranged in parallel to each other.

The first processing block 4A has a multiple (e.g., double) applicationmodule (COT) which are process modules for applying resist to wafer W, amultiple (e.g., triple) first oven module (OVN) 21 which are processmodules for conducting pre-bake process on wafer W after resistapplication, a horizontal second conveying module 32 which is movable inhorizontal X, Y directions and vertical Z direction, for conveying waferW between application module 20 and first oven module 21, and a turnoutmodule 30 capable of transferring wafer W to/from second conveyingmodule 32.

On the other hand, the second processing block 4B has a multiple secondoven module (OVN) 22 which are process modules for conducting postexposure bake process aiming at preventing occurrence of fringe of waferW after exposure process or at inducing acid catalytic reaction inchemical amplification type resist, and conducting post-bake process onwafer W after development process, a development module (DEV) 23 whichis a process module for conducting development process on wafer W, and athird conveying module 33 which is movable in horizontal X, Y directionsand vertical Z direction, for conveying wafer W between developmentmodule 23 and second oven module 22.

Further, first interface part 6 is provided with a first conveyingmodule 31 which is movable in horizontal X, Y directions and vertical Zdirection. By means of first conveying module 31, unprocessed wafer Waccommodated in carrying-in cassette module 1 is taken out, and conveyedto one of the transferring parts of first transfer module 11, whileprocessed wafer W residing in the other of the transferring parts offirst transfer module 11 is received and conveyed (accommodated) incarrying-out cassette module 2.

Further, the second interface part 7 is provided with a circumferenceexposure module 40 for removing resist in the circumference of wafer Won which resist is applied, a buffer module 50 for temporarily waitingfor wafer W which is transferred to/from exposure part 5, and a fourthconveying module 34 which is movable in horizontal X, Y directions andvertical Z direction, for transferring wafer W between circumferenceexposure module 40, and buffer module 50 and exposure part 5.

In the processing system configured as described above, applicationmodule 20, development module 23, first and second oven modules 21, 22and the like process modules, first to fourth conveying modules 31 to34, turnout module 30 and any other modules are electrically connectedto a central processing unit (CPU) 60 (hereinafter, referred to as CPU60) of a computer which is a controller, and every module is centrallycontrolled by CPU 60. In other words, a measure is taken so that atrouble occurring in an individual module is detected by a program thatexecutes a convey schedule and a processing schedule stored in CPU 60,or selection or switching (changing) of these schedules, and conveysteps and processing steps of wafer W are controlled in an optimum waybased on a detection signal, as will be described later.

According to the processing system configured as described above, basedon control signals for executing a convey schedule and a processingschedule stored in CPU 60, or selection or switching (changing) of theseschedules, wafer W is processed in the steps (procedure) as will bedescribed below.

First, first conveying module 31 provided in first interface part 6takes out un-processed wafer W accommodated in carrying-in cassettemodule 1, and the taken out wafer W is conveyed to first transfer module11. Then second conveying module 32 disposed in first processing block4A takes wafer 7 out of first transfer module 11, and carrying the sameinto double application module 20 sequentially. Inside applicationmodule 20, resist is applied on surface of wafer W in a uniformthickness.

Upon application of resist, second conveying module 32 carries out waferW from application module 20, and sequentially carrying it into triplefirst oven module 21. Inside first oven module 21, wafer W is subjectedto pre-bake process for a predetermined time at predeterminedtemperature, e.g., at 100° C. As a result, residual solvent is removedby evaporation from resist film on wafer W.

Upon completion of pre-bake, second conveying module 32 carries water Wout of first oven module 21, and conveys it to second transfer module12. Then third conveying module 33 disposed in second processing block4B takes wafer W out of second transfer module 12 and conveys it tothird transfer module 13. Wafer W conveyed to third transfer module 13is taken out by fourth conveying module 34 disposed in second interfacepart 7 and carried into circumference exposure module 40 where wafer Wundergoes exposure process in its edge part.

Upon completion of circumference exposure process, fourth conveyingmodule 34 takes wafer W out of circumference exposure module 40, andcarries it into exposure part 5.

Upon completion of exposure process in exposure part 5, fourth conveyingmodule 34 receives wafer W from inside exposure part 5, and conveys thereceived wafer W to third transfer module 13. Then third conveyingmodule 33 receives wafer W from third transfer module 13 and carries itinto post-exposure oven (not shown) in second oven module 22. Insidepost-exposure oven, wafer W is subjected to post exposure bake processfor a predetermined time at predetermined temperature, e.g., at 120° C.This prevents occurrence of fringe, and induces acid catalytic reactionin chemical amplification type resist. Therefore, accurate control isrequired so that time lag will not occur from exposure process to postexposure bake. Although the present description is made for a case wherepost exposure oven is incorporated into second oven module 22 in secondprocessing block 4B, the post-exposure oven may be disposed insidesecond interface part 7.

Thereafter, wafer W is carried sequentially into double developmentmodule 23 by third conveying module 33. Inside development module 23,development process is conducted while a developing agent is applieduniformly on resist on the surface of wafer W. Upon completion ofdevelopment, the developing agent is washed out by application ofrinsing liquid on the surface of wafer W.

Upon completion of development step, third conveying module 33 carrieswafer W out of development module 23 and then carries it into multiplesecond oven module 22 sequentially. Inside second oven module 22, waferW is subjected to post bake process for a predetermined time, forexample, at 100° C. As a result, resist that is swelled duringdevelopment is cured and chemical resistance is improved.

Upon completion of post bake, third conveying module 33 carriesprocessed wafer W out of second oven module 22, and conveys it to secondtransfer module 12. As wafer W is conveyed to second transfer module 12,second conveying module 32 receives wafer W from second transfer module12 and conveys wafer W to first transfer module 1. Then first conveyingmodule 31 receives wafer W from first transfer module 11 and conveys itserially into carrying-out cassette module 2, and ends the process.

Next, one exemplary countermeasure against trouble in the processingsystem will be described with reference to FIGS. 2 to 6 and flowchart ofFIG. 9. Here, description will be made for a case where a trouble occursin application module 20 of first processing block 4A during conveyanceand processing of an A rot (A1 to A25) and a B rot (B1 to B25) eachincluding 25 wafers W.

First, for example, when a trouble occur at last wafer W (A25) of A rotwhich is being processed in one unit of double application module 20,occurrence of trouble is detected by a scanning signal of CPU 60, namelya check signal for conveyance exclusion (FIG. 9, Step 9-1) {FIG. 2 (FIG.9, Step 9-2)}. Then whether or not conveyance to the application module20 of a conveyance destination is being executed is determined (FIG. 9,Step 9-3) In the present case, since conveyance of second wafer W (B2)in B rot to application module 20 is not conducted by second conveyingmodule 32, turnout module 30 is determined as the conveyance destinationof wafer W (B2) (FIG. 9, Step 9-4). Then whether or not turnout module30 is useable is determined (FIG. 9, Step 9-6), and if turnout module 30is useable, convey schedule is changed, and the conveyance destinationis changed to turnout module 30 (FIG. 9, Step 9-7), and wafer W (B2) isconveyed to turnout module 30 by second conveying module 32 (see FIG.3). While wafer W (B2) is conveyed to turnout module 30, conveyance ofthird wafer W (B3) in B rot before application module 20 where thetrouble occurs is temporarily stopped. Conveyance and processing ofother wafers W are continued (FIG. 9, Step 9-10).

Thereafter, convey schedule is switched, and first wafer W (B1) in B rotinside normal y-operating application module 20 is subjected toapplication process, and carried into first oven module 21 by secondconveying module 32. Then second conveying module 32 receives wafer W(B2) from turnout module 30 and carries it into normally-operatingapplication module 20 (see FIG. 4). Thereafter, as twenty-fourth wafer W(A24) in A rot processed inside first oven module 21 is taken out offirst oven module 21 (see FIG. 5), wafer W (B2) having subjected toapplication process by normally-operating application module 20 iscarried into first oven module 21 by second conveying module 32, andthen wafer W (B3) for which convey is temporarily stopped is carriedinto normally-operating application module 20 by second conveying module32 (see FIG. 6).

During conveyance to the conveyance destination module (applicationmodule 20), turnout module 30 is determined as the conveyancedestination after stopping conveyance (FIG. 9, Step 9-5). When turnoutmodule 30 is not useable, conveyance is stopped until the conveyancedestination module (application module 20) returns from trouble (FIG. 9,Step 9-9).

Although the above description is made for a case where a trouble occursin one unit of application module 20 including a plurality of processmodules, similar countermeasure against trouble may be employed in acase where a trouble occurs in a single module. For example, as shown inFIG. 7, when a trouble occurs in a module of preceding step of secondconveying module 32, occurrence of trouble is detected (FIG. 9, Step9-2) by scanning signal of CPU 60, namely checking signal of conveyanceexclusion (FIG. 9, Step 9-1). Then whether or not conveyance toapplication module 20 which is the conveyance destination is beingexecuted is determined (FIG. 9, Step 9-3). In the present case, sincewafer W (B3) in B rot is not conveyed to application module 20 by secondconveying module 32, turnout module 30 is determined as the conveyancedestination of wafer W (B3) (FIG. 9, Step 9-4). Then whether or notturnout module 30 is useable is determined (FIG. 9, Step 9-6), and ifturnout module 30 is useable, convey schedule is changed, and theconveyance destination is changed to turnout module 30 (FIG. 9, Step9-7), and wafer W (B3) is conveyed to turnout module 30 by secondconveying module 32 (see FIG. 8). While wafer W (B3) is conveyed toturnout module 30, conveyance of wafers W (B4, B35) before applicationmodule 20 where the trouble occurs is temporarily stopped. Conveyanceand processing of other wafers W are continued (FIG. 9, Step 9-10).

In the above embodiment, description is made for a case where turnoutmodule 30 is separately provided, however, as shown in FIG. 10, transfermodules 11, 12, 13 or buffer module 50, or a vacant module provided inthe processing system may be used as a turnout module instead ofseparately provided turnout module 30. In FIG. 10, an identical part isdenoted by the same symbol and description thereof will not be repeatedbecause the present case is as same as the first embodiment except thatturnout module is not separately provided.

For example, as described above, when a trouble occurs in wafer W whichis being processed in one unit of application module 20, occurrence oftrouble is detected (FIG. 9, Step 9-2) by a scanning signal of CPU 60,namely checking signal of conveyance exclusion (FIG. 9, Step 9-1). Thenwhether wafer is being conveyed to application module 20 of theconveyance destination (FIG. 9, Step 9-3). In this case, if wafer W isnot conveyed to application module 20 by second conveying module 32,second transfer module 12 by which turnout module is shared isdetermined as the conveyance destination of wafer W (FIG. 9, Step 9-4).Then whether or not second transfer module 12 is useable is determined(FIG. 9, Step 9-6), and if second transfer module 12 is usable, in otherwords, second transfer module 12 is vacant, convey schedule is changedand the conveyance destination is changed to second transfer module 12(FIG. 9, Step 9-7), and wafer W is conveyed to second transfer module bysecond conveying module 32. While wafer 7 is conveyed to second transfermodule 12, conveyance of wafer 7 before application module 20 where thetrouble occurs is temporarily stopped. Conveyance and processing ofother wafers W are continued (FIG. 9, Step 9-10).

When a trouble occurs in module of before or after exposure process (forexample, in circumference exposure module 40), buffer module 50 may beused as turnout module.

In a case where wafers W are conveyed to a plurality of process modules,and they are multiply processed by the process modules, a vacant processmodule may be used as a turnout module where there is a vacant processmodule. In this case, as a vacant process module, for example, an ovenmodule or a cooling module may be used, and in a case of using a ovenmodule, it is necessary to use an oven module which is not used and hastemperature which is not elevated (temperature recipe is nottransferred).

According to the processing system configured as described above, waferW which is to be conveyed to a process module where a trouble occurs isconveyed to turnout module 30 (transfer module 11, 12, 13, buffer module50, vacant module), conveyance of wafer W before the module where atrouble occurs is temporarily stopped, and conveyance and processing ofwafer W after the module where a trouble occurs are continued, andthereafter conveyance and processing of wafer W before the module wherea trouble occurs may be conducted. Therefore, even when a trouble occursin part of modules, it is possible to execute conveyance and processingof wafer W smoothly, and to keep the cycle time control. In particular,even when a trouble occurs in a module situated between carrying-incassette module 1 and exposure part 5, it is possible to preventoccurrence of time lag from exposure to post exposure bake (PED time),Also, it is possible to prevent wafer W processed in oven-series modulefrom being over-baked.

By using existent first to third transfer modules 11 to 13 or buffermodule 50 as a turnout module, it is possible to downsize the device.

In the above embodiment, description is made for a case where asubstrate convey processing device, a trouble countermeasure method anda trouble countermeasures program are applied to a resist applicationand development processing system for wafer, however, they may beapplied to application and development processing system for LCD glasssubstrate.

It is to be understood that the foregoing embodiments are in allrespects illustrative and non-limitative. The scope of the presentinvention is defined only by attached claims and not by the abovedescription, and any modifications within the meanings and ranges ofequivalence and claims are embraced in the present invention.

1. A substrate convey processing device comprising: a carrying-incassette module for accommodating a plurality of un-processed substratesto be processed; a plurality of process modules for conductingpredetermined processes on the substrate to be processed; a carrying-outcassette module for accommodating the processed substrates; andconveying modules for conveying the substrate to be processed betweeneach of the modules, in which the substrate to be processed from saidcarrying-in cassette module is conveyed to each of the process modulesin a distributed manner by said conveying module, and the substrate tobe processed is processed by each of the plurality of process modules ina distributed manner, the substrate convey processing device furthercomprising: a turnout module for transferring the substrate to beprocessed to/from said conveying module, and a controller for detectinga trouble occurring in said process module, and centrally controllingeach of the modules based on a detection signal, wherein when saidcontroller detects the trouble occurring in any one of the processmodules, the substrate to be processed to be conveyed to the processmodule where the trouble occurs is conveyed to said turnout module,conveyance of the substrates to be processed before the process modulewhere the trouble occurs is temporarily stopped, and conveyance andprocessing of the other substrates to be processed are continued, andthereafter conveyance and processing of the substrates to be processedbefore the process module where the trouble occurs are conducted.
 2. Thesubstrate convey processing device according to claim 1, wherein saidturnout module is a transfer module disposed between blocks having theplurality of modules, for transferring the substrate to be processedbetween the adjacent blocks.
 3. The substrate convey processing deviceaccording to claim 1, wherein said turnout module is a buffer moduledisposed in a block having the plurality of modules, and capable oftransferring the substrate to be processed in the block.
 4. Thesubstrate convey processing device according to claim 1, wherein saidturnout module is an unused vacant module.
 5. A trouble countermeasuremethod in a substrate convey processing device including: a carrying-incassette module for accommodating a plurality of un-processed substratesto be processed; a plurality of process modules for conductingpredetermined processes on the substrate to be processed; a carrying-outcassette module for accommodating the processed substrates; andconveying modules for conveying the substrate to be processed betweeneach of the modules, in which the substrate to be processed from saidcarrying-in cassette module is conveyed to each of the process modulesin a distributed manner by said conveying module, and the substrate tobe processed is processed by each of the plurality of process modules ina distributed manner, the trouble countermeasure method comprising thesteps of: detecting a trouble occurring in any one of the processmodules; conveying the substrate to be processed to be conveyed to theprocess module where the trouble occurs to a turnout module fortransferring the substrate to be processed to/from said conveyingmodule, based on a signal detected by said controller; temporarilystopping conveyance of the substrates to be processed before the processmodule where the trouble occurs; continuing conveyance and processing ofthe substrates to be processed after the process module where thetrouble occurs; and thereafter, conducting conveyance and processing ofthe substrates to be processed before the process module where thetrouble occurs, by a controller for centrally controlling each of themodules.
 6. The trouble countermeasure method in the substrate conveyprocessing device according to claim 5, wherein said turnout module is atransfer module disposed between blocks having the plurality of modules,for transferring the substrate to be processed between the adjacentblocks.
 7. The trouble countermeasure method in the substrate conveyprocessing device according to claim 5, wherein said turnout module is abuffer module disposed in a block having the plurality of modules, andcapable of transferring the substrate to be processed in the block. 8.The trouble countermeasure method in the substrate convey processingdevice according to claim 5, wherein said turnout module is an unusedvacant module.
 9. A trouble countermeasures program in a substrateconvey processing device including: a carrying-in cassette module foraccommodating a plurality of un-processed substrates to be processed; aplurality of process modules for conducting predetermined processes onthe substrate to be processed; a carrying-out cassette module foraccommodating the processed substrates; and conveying modules forconveying the substrate to be processed between each of the modules, inwhich the substrate to be processed from said carrying-in cassettemodule is conveyed to each of the process modules in a distributedmanner by said conveying module, and the substrate to be processed isprocessed by each of the plurality of process modules in a distributedmanner, the trouble countermeasures program causing a computer toexecute the procedures of: detecting a trouble occurring in any one ofthe process modules; conveying the substrate to be processed to beconveyed to the process module where the trouble occurs to a turnoutmodule for transferring the substrate to be processed to/from saidconveying module, based on said detection signal; temporarily stoppingconveyance of the substrates to be processed before the process modulewhere the trouble occurs; continuing conveyance and processing of thesubstrates to be processed after the process module where the troubleoccurs; and thereafter, conducting conveyance and processing of thesubstrates to be processed before the process module where the troubleoccurs.